Email Proven AI performance at scale

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Project Recently completed, these Supermicro SuperClusters can reduce power requirements through efficient direct liquid cooling DLC technology. At the same time, we are now launching solutions using our Building Block technology. Servers equipped with NVIDIA HGX B200 8GPU can be quickly designed and can be freely configured with liquid cooling or air cooling. Our SuperCluster provides unprecedented density, performance and efficiency, laying the foundation for more intensive AI computing solutions in the future. Supermicros computing clusters coupled with direct liquid cooling technology can help the entire data center achieve higher performance, lower power consumption, and reduce operating costs. For more.

Information, please visit supermicro Subscribe for free to the Meet cayman islands telegram number Innovation and Entrepreneurship enewsletter to keep up with the latest entrepreneurial news and community dynamics Please enter Supermicro NVIDIA HGX B200 system The upgraded SuperCluster scalable unit adopts a racklevel design and features an innovative vertical coolant distribution manifold CDM, which can increase the number of computing nodes in a single rack. A newly developed highefficiency heat dissipation cold plate and advanced hose design further improve liquid cooling system efficiency. New inRow coolant distribution units CDUs suitable for large deployments can also be incorporated.

Into the cooling configuration of the computing cluster. Traditional aircooled data centers can also use the new NVIDIA HGX B200 8GPU system with the new aircooled system chassis. The new Supermicro NVIDIA HGX B200 8GPU system provides a number of upgrades compared to the previous generation. These new systems include optimizations for cooling and power configurations, and support dual 500W Intel Xeon 6 with DDR5 MRDIMM, transfer speeds up to 8800 MTs or AMD EPYCTM 9005 series processors. The new aircooled 10U model Supermicro NVIDIA HGX B200 system uses a redesigned chassis with better heat dissipation space to support eight.